Grinding and polishing are the core technologies that decide the
quality and the characteristics of semiconductors. Rokko is continuously
developing its process by adopting new technologies created by consecutive
improvements. Because of this effort, Rokko takes a very important
role in the fields of MEMS special wafer grinding and polishing
processes and its highly established technologies enable the company
to fulfill customer’s requests derived from various phases such
as R&D or volume productions.
■ Processing Technolgy
Precise grinding is the very important factor
for eliminating thickness deviations. In this process, the
right type of machine that meets customer’s requirements is
carefully selected among the variety of process equipment.
Rokko’s grinding technologies are able to guarantee the minimum
thickness of 15um in prototyping and 100 to 150um in volume
productions.
■ Polishing Technology
After grinding, small roughness is created
on wafer surface. In this process, wafers are carefully polished
to remove the roughness. The polishing needs to be done in
precise and speedy manners to avoid any distortions and scratches
on wafer surface.
■ MEMS Technology
Rokkos’s technologies enable the company to
provide integrated grinding and polishing services for MEMS
(Micro Electronics Mechanical System) processed wafers such
as SOI・glass/Si mounted, through-holed, cavity structured,
through-silicon via (TSV) and non-circular.
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